University of Dayton School of Engineering

UD Engineers Take First, Third Prizes at Research Fair

By Kelly Garrow, School of Engineering

Students from area colleges and universities recently showcased their research at the second annual STEM-Cyber Research Fair, which was held this year at the Southwestern Ohio Council for Higher Education (SOCHE) facility.

The event, held in collaboration with the Air Force Institute of Technology, Sinclair Community College’s National UAS Training and Certification Center, and the University of Dayton, attracted 22 student researchers.

President of SOCHE, Sean Joseph Creighton, presented University of Dayton student, Nuha Al Habis, with the first place prize of a $100 gift card. Second place, $75, was awarded to Captain Inna Chavez of the Air Force Institute of Technology. The third place award of $50 was presented to University of Dayton student, Venkat Rajeev Reddy Malipeddi.

Al Habis is a doctoral candidate in materials engineering whose research topic was Enhancing the Cell Proliferation using Conductive Scaffolds. Malipeddi, who will receive his master’s degree in computer science this spring, presented on Web and Mobile Application Development to Meet the Needs of the Dayton Food Bank.

“The Dayton-Cincinnati region is rich in innovative research thanks to the dedication of our youngest scientists, and this annual research fair is one way to showcase student talent,” said Creighton.

Congratulations to these student researchers.

Previous Post

Engineering Scholar-Athletes Honored

Engineering scholar-athletes were recognized by the University of Dayton for their accomplishments in the classroom and in the community.

Read More
Next Post

Engineering Alumnus Wins Flyer Pitch; Three of Six Finalists are Engineers

University of Dayton chemical engineering alumnus Zach McHale won first place and $25,000 for his stadium seat device in the University of Dayton?s 11th annual Flyer Pitch competition, one of the largest collegiate-level business plan contests in the country.

Read More