Courses: EOP 632/ECE 682
- Design of cleanrooms
- Contamination control
- Chemical safety
- Basic kinetic theory of gases
- Vacuum pumps
- Vacuum measurements and diagnostics
- Gas flow measurement
- Basic plasma theory
- DC, RF, parallel plate and magnetron, ICP configurations
- Properties of silicon and crystal orientations
- Quartz, fused-silica, III-V substrates
- Wafer cleaning processes
- RF and DC sputter deposition
- Filament and electron-beam evaporation
- Plasma-enhanced chemical vapor deposition
- Measuring and controlling film thickness
- Film stress theory and measurement
- Optical properties of thin films
- Optical filter design and fabrication configurations
- Basic photoresist chemistry
- Dill parameters for modeling photoresists
- Positive and negative resists and image reversal
- Photomask design
- Contact and projection printing techniques
- Alignment techniques
- Thin film lift-off techniques
- SU8 and thick film processes
- Etch chemistries and thermodynamics
- Etch rates, selectivity and masks
- Plasma etching and ion beam milling
- Inductively coupled plasma etching
- Aniosotropic and isotropic etch chemistries
- Bulk micro-machining for MEMS devices
- Doping by thermal diffusion
- Doping by implantation
- Annealing
- Surface profilometry
- Optical thin film characterization
- Scanning electron microscopy
- FEOL and BEOL manufacturing phases
- Damascene process
- Foundry processes
- Integrated optical devices and waveguides
- Photodetectors
- Diodes and transistors
