• Design of cleanrooms
• Contamination control
• Chemical safety

• Basic kinetic theory of gases
• Vacuum pumps
• Vacuum measurements and diagnostics
• Gas flow measurement
• Basic plasma theory
• DC, RF, parallel plate and magnetron, ICP configurations

• Properties of silicon and crystal orientations
• Quartz, fused-silica, III-V substrates
• Wafer cleaning processes

• RF and DC sputter deposition
• Filament and electron-beam evaporation
• Plasma-enhanced chemical vapor deposition
• Measuring and controlling film thickness
• Film stress theory and measurement
• Optical properties of thin films
• Optical filter design and fabrication configurations

• Basic photoresist chemistry
• Dill parameters for modeling photoresists
• Positive and negative resists and image reversal
• Photomask design
• Contact and projection printing techniques
• Alignment techniques
• Thin film lift-off techniques
• SU8 and thick film processes

• Etch chemistries and thermodynamics
• Etch rates, selectivity and masks
• Plasma etching and ion beam milling
• Inductively coupled plasma etching

• Aniosotropic and isotropic etch chemistries
• Bulk micro-machining for MEMS devices

DOPING AND IMPLANTATION

• Doping by thermal diffusion
• Doping by implantation
• Annealing

MICRO-METROLOGY

• Surface profilometry
• Optical thin film characterization
• Scanning electron microscopy

• FEOL and BEOL manufacturing phases
• Damascene process
• Foundry processes

• Integrated optical devices and waveguides
• Photodetectors
• Diodes and transistors